TechnicalNews

A camera that can see through walls

Y Combinator

Bill Abster from Applied Electromagnetics discusses his company's breakthrough technology that uses radio waves and high-frequency antennas to create 3D images of objects behind opaque materials. The system processes echoes in real-time using GPUs to generate detailed depth maps, and the company has achieved significant progress in just 4 months by maintaining rapid iteration cycles.

Summary

Bill Abster, founder of Applied Electromagnetics, explains how his company is developing cameras that can see through opaque materials like drywall and marble. The idea originated from a personal experience during home remodeling when hidden structural problems behind walls caused expensive repairs, prompting Abster to develop a solution leveraging his background in radars and antennas.

The technology operates using radio waves at high frequencies, requiring operation of many antennas simultaneously. The system captures complete 3D images with depth information by processing echoes in real-time. Abster demonstrates the capability using concrete examples: stickers placed behind drywall on acrylic, and construction elements (studs, junction boxes, pipes, cables) behind marble slabs. The resulting images are accurate to pixel-level measurements that match physical world dimensions.

The technology became feasible through two key developments: the widespread availability of high-frequency chipsets (multichips) and the GPU revolution, which enables processing of the large data streams generated by the echoes to be done on-the-go and converted into images. Abster notes the company has been operating full-time for only 4 months while building 'day and night,' with the demonstrated device being version three. He emphasizes that rapid iteration speed is critical for hardware companies, continuously releasing iterations to identify bottlenecks and opportunities for parallel development.

Key Insights

  • The through-wall imaging technology became feasible because high-frequency antenna chipsets became widely available and GPU computing enabled real-time processing of the large echo data streams to generate images
  • The system captures complete 3D images with precise depth information that maintains one-to-one correspondence with actual physical world dimensions when measured by pixels
  • The company was founded based on a personal problem: discovering expensive hidden structural issues behind walls during home remodeling that motivated building a solution
  • Despite being only 4 months into full-time operation, the company has already developed three iterations of their device by maintaining constant building and iteration cycles
  • For hardware companies, maintaining rapid iteration speed is more important than waiting to perfect a design; the key is continuously releasing versions while identifying bottlenecks and parallel development opportunities

Topics

Through-wall imaging technologyRadio wave and antenna-based sensing3D depth mapping and image processingGPU-accelerated real-time processingHardware iteration and development speed

Transcript

[0:00] Uh my name is Bill Abster. We're building applied electronamics doing new kind of cameras that can see through an opaque material. >> How did you get into that idea? >> Uh it actually started from a personal experience. During our remodels, we discovered a bunch of stuff that existed behind the walls that cost us a lot of money to fix. So we decided that there needs to be something that can see through the walls. My background is in radars and antennas. And I figured out we can do it with radio waves and we've been building it ever since. If you want to do it right, then you have to operate a lot of antennas at…

Full transcript available for MurmurCast members

Sign Up to Access

More from Y Combinator

Get AI summaries like this delivered to your inbox daily

Get AI summaries delivered to your inbox

MurmurCast summarizes your YouTube channels, podcasts, and newsletters into one daily email digest.