How the Industry is Building Chips That Should Be Physically Impossible

This podcast features Chun Hun Lim, Senior VP and CEO of semiconductor solutions advanced packaging at ASMPT, discussing his journey from industrial engineering to leading one of the world's top equipment companies in assembly and packaging. Lim reveals how he pioneered just-in-time manufacturing in the semiconductor industry early in his career, transforming operations from low to high efficiency. He emphasizes the importance of strategic thinking and forward-looking leadership, noting that 'what happens today is what you did 5 years ago.' ASMPT has achieved dominance in the advanced packaging market through being first movers and taking risks with elite customers. Their TCB (Thermal Compression Bonding) technology achieves ±0.5 microns placement accuracy, which is 2-3 times better than competitors. The company has built a massive 10:1 install base advantage and can stack up to 16-high HBM stacks with sub-micron accuracy. Lim discusses the future of advanced packaging, highlighting glass core substrates as the next frontier and co-packaged optics gaining momentum with expected takeoff in 2-3 years when 800 gig transmission is widely adopted. He predicts the silicon photonics market will grow at 25% CAGR and describes ASMPT's micron solution achieving sub-0.2 micron accuracy for optical elements. Throughout the conversation, Lim emphasizes the importance of consistent messaging, team alignment, and continuous learning while maintaining that the future of advanced packaging is 'infinite' and limited only by human creativity.